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Advanced Processes for Superior Performance and Long Life
CoorsTek understands metal-to-ceramic joining. Whether you are adding an electronic circuit
path to one of our high-purity substrates or joining a metal component with ceramic, our
metallization and joining experts help you select the most effective and cost-efficient method
and material. Sample applications include:
- Antennas
- Feed-through insulators
- Headers
- High-power receptacles
- Hybrid circuits
- Insulator rings and cylinders
- Insulating discs
- Micro-ceramic components
- Power grid tubes
- Power switches
- Sensors
- Traveling wave tubes
- Vacuum interrupters
- Windows
- X-ray tubes
Related Links:
Electron Tube Components
Related Literature:
Advanced
Metallized Ceramics for Electronic Applications
PDF Document (74.3 K)
Thick-Film Coating Design Guide
PDF Document (327 K)
Contact Information:
Custom Component Metallizing Experts
+1.303.277.4567 Tel
+1.303.277.4215 Fax
Ceramic Substrate Metallizing Experts
+1.303.277.4766 Tel
+1.303.277.4779 Fax
European Contact Information:
Ceramic Substrate Metallizing Experts
+44.1592.773743 Tel
+44.1592.774925 Fax
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