| December 13, 2005 |
CoorsTek Partners with Sealing Devices, Inc.
for Master Distributorship |
May 25, 2005 |
CoorsTek to Present at AME Conference |
| May 25, 2005 |
CoorsTek Receives Highest Supplier
Award from Wabash Technologies Two Years Consecutively |
April 19, 2005 |
CoorsTek Attains TS-16949 Certification
|
| March 8, 2005 |
CoorsTek Offers New
SmoothEdge™ Ceramic Substrates for Improved Automated Handling |
March 1, 2005 |
CoorsTek Introduces PolyGlyde™ Self-Lubricating Seals |
| November 12, 2004 |
CoorsTek Introduces UltraFine™ Thick-Film Ceramic Substrates |
November 10, 2004 |
Military Official Thanks Ceramic Armor Providers |
| October 11, 2004 |
CoorsTek Announces New President and COO |
August 11, 2004 |
CoorsTek Hires New GSM
for Engineering Plastics Division |
| August 4, 2004 |
CoorsTek and Boostec to Share
Technology For Silicon Carbide Optical Components |
May 3, 2004 |
CoorsTek Introduces Dura-Z™ Zirconia Material
for Extreme-Service Applications |
| March 30, 2004 |
CoorsTek Partners with Heany Industries for Advanced Coating Technologies in Oil and Gas Market |
February 9, 2004 |
CoorsTek Scotland Facility Approved to new ISO/TS-16949:2002 Automotive Manufacturing Standard |
| October 30, 2003 |
CoorsTek and St. Marys Carbon Team to Provide Carbon Graphite Mechanical Seals |
| July 1, 2003 |
CoorsTek Expands Korean Facility To Match
Growing Demand in Asian Markets |
| July 1, 2003 |
CoorsTek Announces New
Rapid Product Introduction Teams |
| May 12, 2003 |
CoorsTek Offers New Thick-Film Photo-Etching Technology for Ceramic Substrates |
| April 30, 2003 |
CoorsTek Relationship with EDS-provider InVision Expands into Engineering Services |
| April 23, 2003 |
CoorsTek Develops High and Low-Resistivity CVD SiC |
| March 18, 2003 |
CoorsTek Develops New MidFilm© Substrate Technology for High-Frequency Thick-Film and Other Applications |
| February 19, 2003 |
CoorsTek Signs License Agreement for Ball Aerospace Patented Patch Antenna Technology |
| October 20, 2002 |
CoorsTek Develops Innovative Process to Create Hermetically Sealed Multi-Layer Components |
