Thick-Film Electronic Substrates

Why Ceramic Thick-Film Substrates?

CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. We help you design a thick-film ceramic substrate tailored to your application:

• Material selection
• Size & thickness
• Tolerancing
• Laser machining & scribing
• Edge finishing
• Inspection & special requirements

 

Alumina

Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications.  More >>

Alumina Thick-Film Substrates

CoorsTek ADS-96R thick-film alumina substrates are the standard, particularly well suited for small-geometry, high-resistance circuitry — engineered to minimize resistivity variation and maximize aged adhesion.

MidFilm Substrates

CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.

Opaque Thick-Film Substrates

For light-sensitive semiconductor device applications, use CoorsTek opaque ADOS-90R alumina material — formulated specifically to block light transmittance and absorb stray light.

Substrate Size and Thickness

Substrate Thickness (Alumina)		Substrate Size (Alumina)
Thick-film substrate thicknesses range from 0.381 mm to 2.54 mm. The most common thicknesses range from 0.635 mm to 1.016 mm. Minimum hole diameters are based on thickness.		CoorsTek offers a wide range of standard and common sizes. Contact us if you need a larger size or complex geometry.
Substrate Thickness Minimum Hole Diameter 0.635 - 0.889 mm 0.381 mm 0.914 - 1.524 mm 0.508 mm 1.549 - 2.032 mm 0.635 mm		Standard Sizes     114.3 x 114.3 mm  139.7 x 165.2 mm   114.3 x 165.2 mm 139.7 x 190.5 mm   127.0 x 177.8 mm

Thick-Film Ceramic Substrate Design Guide 

Contact us to receive a copy of the Thick-Film Ceramic Substrate Design Guide:

Laser Scribing

CoorsTek offers special differential scribing to enhance preferential singulation. By varying the laser pulse spacing and depth in the (x) and (y) scribe directions, the sequence of singulation is controlled more precisely. Enhanced laser scribing helps prevent hooking, chipping, and premature breakage — improving process yields. Our Design Guide provides typical scribe line configurations and tolerances. 

Laser Machining

CoorsTek provides a wide range of laser machining, profiling, drilling, scribing, and annealing services so your substrates fit just what you need in your application. We provide design consultation, rapid prototyping, and expedited deliveries. 

Edge Finishing

Laser Scribed Edge

SMOOTHEDGE™ SUBSTRATES

SilkEdge™ Substrates