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Ceramic Coatings

Ceramic Coatings Improve Surface Properties Without Compromising Bulk Material Performance


CoorsTek ceramic coatings are applied on a range of ceramic and metal substrate options to enhance a component's surface performance in a variety of demanding environments  — such as improving resistance to chemicals, impurities and particulates, plasma etch, static electricity buildup, and other harsh conditions. 

Each combination of coating and substrate is engineered for material match and bonding — leveraging the benefits of each material for the application, frequently enabling a larger, better performing, more cost-effective part than possible otherwise. 

Coating Added Properties

  • Static Electricity Dissipation
  • Thermal Conductivity 
  • Corrosion Resistance
  • Metal Joining
  • Hermetic Structures
  • Increased Durability
  • Ultra-Pure Surface
  • Cost Reduction
  • Etch Resistance

Coating Materials

Example Applications

Environmental barrier coatings (EBCs) are used for supplemental surface protection in in harsh applications.

Coatings are generally applied when a specific metal or ceramic is required, but cannot withstand the operating conditions — like turbine applications where the combination of a corrosive environment and high heat can cause rapid deterioration. A ceramic coating can add chemical and thermal protection without adding a significant amount of mass.


ESD-Safe Coating

ArcResist coating dissipates the electrostatic charge buildup on the surface of components, preventing arcing or rapid discharge (ESD) while maintaining the physical property benefits of the substrate material.

Particle & Corrosion Resistant Coating

PureSiC® CVD silicon carbide (SiC) coatings on a graphite or SiC base  provide a durable, particle-free surface with robust chemical resistance and 99.9995% purity for semiconductor and other contaminant-free environments. 

Plasma Etch Resistant Coating 

PlasmaResist Yttria coatings on alumina,  aluminum, and titanium deliver exceptional resistance to harsh RF plasma etch conditions, reducing etch rates to extend useful component life.


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