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Ultra-Pure Aluminas

Property Units Semiconductor-Grade Aluminas

99.5% Nom Al2O3

Low Loss Tangent Alumina

99.5% NOM Al2O3

PlasmaPure-UC™ Alumina

99.9% Min Al2O3

Sapphal™ Translucent Alumina

99.9% Al2O3

Minor Chemistry, (Total)

ppm weight

2500-3000

3000

400

500

Grain Size

μm

0.5-40

0.7-35

0.4-32

2-50

Flexural Strength (MOR), 3-point

MPa

379-400

379

400

350

Flexural Strength (MOR), 4-point

MPa

300-350

300

360

285

Fracture Toughness, KIc

MPa-m1/2

4-5

4-5

4-5

4-5

Hardness, Vickers 500g

GPa

16-17

16

18

18

Hardness, Vickers 1000g

GPa

16-17

16

17

17

Elastic Modulus

GPA

370-380

370-380

386

390

Coefficient of Thermal Expansion, (25°C-1000°C)

1 x 10-6/°C

8.2

8.2

8.2

8.3

Thermal Conductivity

W/m-K

30.0

30.0

33

35

Dielectric Strength, (1 mm)

ac-kV/mm

15.7-16.7

400

470

18.5

Volume Resistivity, (25°C)

ohm-cm

>1014

>1014

>1015

>1015

Volume Resistivity, (500°C)

ohm-cm

2x1015-1011

2x1012

1012

8x1011

Volume Resistivity, (1000°C)

ohm-cm

2x106-107

2x106

108

1010

Dielectric Constant, (1 MHz)

9.7-9.9

9.8

9.8

10

Dielectric Loss (tan δ), (1 MHz)

5x10-5-3x10-4

<1x10-4

<10-4

10-3

The information provided on this chart is for general material property reference only.  The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

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