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Low Loss Tangent Alumina

Composition

99.5% NOM Al2O3

Description

CoorsTek Low Loss Tangent (LLT) Alumina is engineered for remarkably low dielectric loss at high frequencies. Its low and consistent RF dielectric loss tangent mitigates the conversion of RF energy to heat, preventing rapid or excessive heating of chamber components.

Download the Semiconductor Oxides Material Properties Chart

Download the Semiconductor Advanced Alumina Brochure

Columns
Property Units Value

Minor Chemistry, (Total)

ppm weight

3000

Grain Size

μm

0.7-35

Flexural Strength (MOR), 3-point

MPa

379

Flexural Strength (MOR), 4-point

MPa

300

Fracture Toughness, KIc

MPa-m1/2

4-5

Hardness, Vickers 500g

GPa

16

Hardness, Vickers 1000g

GPa

16

Elastic Modulus

GPA

370-380

Coefficient of Thermal Expansion, (25°C-1000°C)

1 x 10-6/°C

8.2

Thermal Conductivity

W/m-K

30.0

Dielectric Strength, (1 mm)

ac-kV/mm

400

Volume Resistivity, (25°C)

ohm-cm

>1014

Volume Resistivity, (500°C)

ohm-cm

2x1012

Volume Resistivity, (1000°C)

ohm-cm

2x106

Dielectric Constant, (1 MHz)

9.8

Dielectric Loss (tan δ), (1 MHz)

<1x10-4

The information provided on this chart is for general material property reference only.  The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

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