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PlasmaPure-UC™ Alumina

Composition

99.9% Min Al2O3

Description

PlasmaPure-UC™ is an ultra-high purity alumina formulated specifically for plasma etch processing components — combining an extremely low dielectric loss tangent with > 99.9% purity.

Download the Semiconductor Oxides Material Properties Chart

Download the Semiconductor Advanced Alumina Brochure

Example Process Applications

Other grades of PlamaPure™ are available. Contact CoorsTek for more information

Columns
Property Units Value

Minor Chemistry, (Total)

ppm weight

400

Grain Size

μm

0.4-32

Flexural Strength (MOR), 3-point

MPa

400

Flexural Strength (MOR), 4-point

MPa

360

Fracture Toughness, KIc

MPa-m1/2

4-5

Hardness, Vickers 500g

GPa

18

Hardness, Vickers 1000g

GPa

17

Elastic Modulus

GPA

386

Coefficient of Thermal Expansion, (25°C-1000°C)

1 x 10-6/°C

8.2

Thermal Conductivity

W/m-K

33

Dielectric Strength, (1 mm)

ac-kV/mm

470

Volume Resistivity, (25°C)

ohm-cm

>1015

Volume Resistivity, (500°C)

ohm-cm

1012

Volume Resistivity, (1000°C)

ohm-cm

108

Dielectric Constant, (1 MHz)

9.8

Dielectric Loss (tan δ), (1 MHz)

<10-4

The information provided on this chart is for general material property reference only.  The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

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