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Thermally Conductive Aluminum Nitride

Property Units Semiconductor Grade AlN

AlN

Grain Size

μm

5-6

Flexural Strength (MOR), 3-point

MPa

300-375

Fracture Toughness, KIc

MPa-m1/2

2.75-3.6

Coefficient of Thermal Expansion, (25°C-1000°C)

1 x 10-6/°C

502-5.5

Volume Resistivity, (25°C)

ohm-cm

1012-1014

Volume Resistivity, (500°C)

ohm-cm

109-1012

Volume Resistivity, (1000°C)

ohm-cm

107-1010

Dielectric Constant, (1 MHz)

8.5-9.05

Dielectric Loss (tan δ), (1 MHz)

2x10-4-7.7x10-3

The information provided on this chart is for general material property reference only.  The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

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